SD-GP15 is a silicone pad which maintains optimal thermal performance. It is characterized for the easy handling and high compression properties. The material is ideal for applications requiring low stress on components and boards during assembly. The natural tack on both sides of the material allows for good compliance to adjacent surfaces of components, minimizing interfacial resistance.

Features and Benefits

  • Thermal conductivity: 1.5 W/m·K
  • Highly conformable / low hardness
  • Decreased strain on fragile components
  • Low compression set enables the pad to be reused many times
  • Quick rebound to original shape

Typical Properties

Color Light green Visual
Thickness Range 0.5 to 6 mm ASTM D374
Density 2.2 g/cc ASTM D792
Hardness (Shore 00) 40 ASTM D2240
Dielectric Breakdown Voltage @1mm > 6KV ASTM D149
Volume Resistivity (Ω·cm) 10¹¹ ASTM D257
Flame Rating V-0 UL 94
Thermal Conductivity (W/m·K) 1.5 ASTM D5470
Thermal Impedance, 1mm, 10 psi 0.83 °C·in.²/W ASTM D5470
Continuous Use Temp. -45°C to 160°C -

Typical Applications

  • Telecommunications
  • Notebook and desktop computers
  • Power conversion
  • Flat panel display
  • Automotive electronics
  • Optical disk drives
  • Memory modules

Available Forms

  • Sheet form , max width 420mm
  • Die-cut parts available, can be customized
  • Can be reinforced with fiberglass
Contact SEDO Now

Contact us to have your questions answered, to obtain free samples, arrange prototypes/small batch runs, and discuss customized solutions for your projects.