SD-GP20 is a thermally conductive, reinforced material rated at a thermal conductivity of about 2.0 W/m·K, low thermal resistances can be achieved at low pressures. This soft interface pad conforms well to minimal pressure, resulting in excellent interfacing and wet‐out characteristics, even to surfaces with high roughness and/or topography. SD-GP20 is naturally tacky, and no adhesive coating is required, to provide easy handling and converting process.

Features and Benefits

  • Thermal conductivity: 2.0 W/m·K
  • Soft and highly compliant
  • Low thermal resistance at low pressure
  • Excellent sticky properties

Typical Properties

Color Yellow Visual
Thickness Range 0.5 to 6 mm ASTM D374
Density 2.4 g/cc ASTM D792
Hardness (Shore 00) 45 ASTM D2240
Dielectric Breakdown Voltage @1mm > 6KV ASTM D149
Volume Resistivity (Ω·cm) 10¹¹ ASTM D257
Flame Rating V-0 UL 94
Thermal Conductivity (W/m·K) 2.0 ASTM D5470
Thermal Impedance @1mm,20psi 0.60 °C·in.²/W ASTM D5470
Continuous Use Temp. -50°C to 180°C -

Typical Applications

  • Semiconductors to heat sink
  • Telecommunications equipment
  • Consumer electronics
  • LCD and PDP flat panel TV

Available Forms

  • Sheet form , max width 300mm
  • Die-cut parts available, can be customized
  • Can be reinforced with fiberglass
Contact SEDO Now

Contact us to have your questions answered, to obtain free samples, arrange prototypes/small batch runs, and discuss customized solutions for your projects.