SD-GP30 is recommended for low-stress applications that require a mid to high thermally conductive interface material. “S-Class” is ultra soft for low thermal resistance at very low pressures, and allows the pad to fill in air voids and air gaps between PC boards and heat sinks or metal chassis with stepped topography, rough surfaces and high stack-up tolerances.

Features and Benefits

  • Thermal conductivity: 3.0 W/m·K
  • “S-Class” for ultra soft hardness
  • Designed for low-stress applications
  • Excellent adhesive properties

Typical Properties

Color Light Gray Visual
Thickness Range 0.5 to 6 mm ASTM D374
Density 3.0 g/cc ASTM D792
Hardness (Shore 00) 40 ASTM D2240
Dielectric Breakdown Voltage @1mm > 6KV ASTM D149
Volume Resistivity (Ω·cm) 10¹¹ ASTM D257
Flame Rating V-0 UL 94
Thermal Conductivity (W/m·K) 3.0 ASTM D5470
Thermal Impedance @1mm, 20psi 0.4 °C·in.²/W ASTM D5470
Continuous Use Temp. -50°C to 180°C -

Typical Applications

  • Semiconductors to heat sink
  • Telecommunications equipment
  • Consumer electronics
  • LCD and PDP flat panel TV

Available Forms

  • Sheet form , max width 300mm
  • die-cut parts available, can be customized
  • Can be reinforced with fiberglass
Contact SEDO Now

Contact us to have your questions answered, to obtain free samples, arrange prototypes/small batch runs, and discuss customized solutions for your projects.