SD-GP30SF is a high-performance, compliant silicone free thermal interface material. By coupling extremely high thermal conductivity (3.0W/m·K) with exceptional ultra-soft characteristics, it provides low thermal resistance between heat source component and heat dissipation part or housing. This makes it well-suited for applications where silicone-based pads are traditionally used as well as those

applications which are silicone sensitive, especially in the optical industry.

Features and Benefits

  • Thermal conductivity: 3.0 W/m·K
  • Soft and slightly surface tacky
  • Silicone free
  • Naturally tacky for easy assembly
  • UL 94 V0

Typical Properties

Color Gray Visual
Reinforcement Carrier None -
Thickness Range 1 to 3 mm ASTM D374
Density 3.2 g/cc ASTM D792
Tensile strength 0.02Mpa ASTM D412
Hardness (Shore 00) 60 ASTM D2240
Dielectric Breakdown Voltage @1mm > 7KV ASTM D149
Volume Resistivity (Ω·cm) 10¹¹ ASTM D257
Flame Rating V-0 UL 94
Thermal Conductivity (W/m·K) 3.0 ASTM D5470
Thermal Impedance @1mm, 20psi 0.40 °C·in.²/W ASTM D5470
Continuous Use Temp. -40°C to 120°C -

Typical Applications

  • Automotive Electronic Control Units (ECU's)
  • Microprocessors / Graphics Processors
  • Consumer electronics
  • Power Supplies & Semiconductors

Available Forms

  • Sheet form , max width 450mm
  • die-cut parts available, can be customized
Contact SEDO Now

Contact us to have your questions answered, to obtain free samples, arrange prototypes/small batch runs, and discuss customized solutions for your projects.