SD-GP50 is a thermally conductive, reinforced material rated at a thermal conductivity of about 5 W/m·K, low thermal resistances can be achieved at low pressures. This soft interface pad conforms well to minimal pressure, resulting in excellent interfacing and wet-out characteristics, even to surfaces with high roughness and/or topography. SD-GP50 is naturally tacky, and no adhesive coating is required, to provide easy handling and converting process.

Features and Benefits

  • Thermal conductivity: 5.0 W/m·K
  • Soft and highly compliant
  • Low thermal resistance at low pressure
  • Excellent adhesive properties

Typical Properties

Color Purple Visual
Thickness Range 0.5 to 6 mm ASTM D374
Density 3.2 g/cc ASTM D792
Hardness (Shore 00) 50 ASTM D2240
Dielectric Breakdown Voltage @1mm > 6KV ASTM D149
Volume Resistivity (Ω·cm) 10¹¹ ASTM D257
Flame Rating V-0 UL 94
Thermal Conductivity (W/m·K) 5.0 ASTM D5470
Thermal Impedance @1mm,20psi 0.32 °C·in.²/W ASTM D5470
Continuous Use Temp. -50°C to 180°C -

Typical Applications

  • Semiconductors to heat sink
  • Telecommunications equipment
  • Consumer electronics
  • LCD and PDP flat panel TV

Available Forms

  • Sheet form , max width 300mm
  • die-cut parts available, can be customized
Contact SEDO Now

Contact us to have your questions answered, to obtain free samples, arrange prototypes/small batch runs, and discuss customized solutions for your projects.