SD-IP13 thermally conductive insulation material is designed for a wide variety of applications requiring high thermal performance and electrical isolation. SD-IP13 material combines a smooth and highly compliant surface characteristic with high thermal conductivity. These features optimize the thermal resistance properties .

Features and Benefits

  • Thermal Conductivity: 1.3W/m K
  • Electrically isolating
  • Low mounting pressures
  • General-purpose thermal interface material solution

Typical Properties

Color Brown Visual
Reinforcement Carrier PI film -
Thickness 0.15 ASTM D374
Hardness (Shore A) 90 ASTM D2240
Elongation 35% ASTM D412
Tensile Strength 25 MPa ASTM D412
Dielectric Breakdown Voltage 6 kV ASTM D149
Volume Resistivity (Ω·cm) 10¹¹ ASTM D257
Thermal Conductivity (W/m.K) 1.3 ASTM D5470
Thermal Impedance,50 psi 0.4°C·in.²/W ASTM D5470
Continuous Use Temp. -40°C to 180°C -

Typical Applications

  • Power supplies
  • Automotive electronics
  • Motor controls
  • Power semiconductor

Available Forms

  • Sheet form, die-cut parts and roll form
  • With or without pressure sensitive adhesive
Contact SEDO Now

Contact us to have your questions answered, to obtain free samples, arrange prototypes/small batch runs, and discuss customized solutions for your projects.