SD-IP18 thermally conductive insulation material is designed for a wide variety of applications requiring high thermal performance and electrical isolation. These applications typically have low mounting pressures for component clamping.

SD-IP18 material combines a smooth and highly compliant surface characteristic with high thermal conductivity. These features optimize the thermal resistance properties at low pressures.

Features and Benefits

  • Thermal Conductivity: 1.8W/m K
  • Electrically isolating
  • Low mounting pressures
  • Smooth and highly compliant surface
  • General-purpose thermal interface material solution

Typical Properties

Color Black Visual
Reinforcement Carrier Fiberglass -
Thickness Range 0.23 ASTM D374
Hardness (Shore A) 88 ASTM D2240
Elongation 3% ASTM D412
Tensile Strength 28 MPa ASTM D412
Dielectric Breakdown Voltage > 6kV ASTM D149
Volume Resistivity (Ω·cm) 10¹⁰ ASTM D257
Flame Rating V-0 UL 94
Thermal Conductivity (W/m·K) 1.8 ASTM D5470
Thermal Impedance,50 psi 0.60°C·in.²/W ASTM D5470
Continuous Use Temp. -40°C to 160°C -

Typical Applications

  • Power supplies
  • Automotive electronics
  • Motor controls
  • Power semiconductor

Available Forms

  • Sheet form, die-cut parts and roll form
  • With or without pressure sensitive adhesive
Contact SEDO Now

Contact us to have your questions answered, to obtain free samples, arrange prototypes/small batch runs, and discuss customized solutions for your projects.