SD-TA15GB is a one-part silicon-based adhesive with high thermal conductive performance, filled with glass bead in order to get a minimum ‘gap’ between two surfaces. The thermal conductivity of SD-TA15GB is 1.5W/m-K. It can adhere well on the rough surfaces of electronic component with a better strength and proper toughness.

Notices: SD-TA15GB can not contact with N, P, S and other organic compounds, no contact with Sn, Pb, Hg, Bi. As plasma compounds, non contact with acetylene, vinyl active compounds, inability to contact

Features and Benefits

  • Thermal conductivity: 1.5 W/m·K

  • Glass beads filled

  • High thermal conductivity

  • Single components

  • Good adhesion to substrates

Typical Properties

Color Grey Visual
Viscosity 60,000 cps ASTM D2196
Density 2.7 g/cc Helium Pycnometer
BLT 0.18mm -
Shelf Life @ 0±5℃ 6 months -
Hardness Shore A 90 ASTM D2240
Unprimed Adhesion-Lap Shear (Al) 4 MPa ASTM D412
Elongation 10% ASTM D412
Temperature Usage -40℃ to 200℃ -
Dielectric Strength 200 VAC/mil ASTM D149
Volume Resistivity 1013Ω·cm ASTM D257
Thermal Conductivity 1.5W/m·K ASTM D5470
Cure @ 125 ℃ 40 mins -

Typical Applications

  • Bonding integrated circuit substrates

  • Adhering lids and housings

  • Base plate attach

  • Heat sink attach, automated or manual dispensing

  • Thermally conductive structural bonding

Available Forms

  • Supplied in 30cc/150cc Syringe
Contact SEDO Now

Contact us to have your questions answered, to obtain free samples, arrange prototypes/small batch runs, and discuss customized solutions for your projects.