SD-GF20

SD-GF2.0 is a high performance, thermally conductive, liquid gap-filling material supplied as a two-component, room or elevated temperature curing system. The material provides a balance of cured material properties and good compression set (memory). The result is a soft, form-in-place elastomer ideal for coupling “hot” electronic components mounted on PCB with an adjacent metal case or heat sink.

Features and Benefits

• Thermal conductivity: 2.0 W/m·K
• Ultra-conforming, designed for fragile and low-stress applications
• Ambient and accelerated cure schedules
• Excellent low and high temperature mechanical and chemical stability

Typical Properties

PHYSICAL	TYPICAL RESULTS	TEST METHOD
Color / Part A	Yellow	Visual
Color / Part B	White	Visual
Viscosity as Mixed	250,000 mPas	ASTM D2196
Density	2.7 g/cc	ASTM D792
Mix Ratio	1:1	-
Shelf Life @ 25°C	6 months	ASTM D412
PROPERTY AS CURED
Color	Yellow	Visual
Hardness, Shore 00	50	ASTM D2240
ELECTRICAL AS CURED
Dielectric Strength	7kV/mm	ASTM D149
Volume Resistivity (Ω·cm)	≥ 10¹⁰	ASTM D257
Flame Rating	V-0	UL 94
THERMAL AS CURED
Thermal Conductivity (W/m·K)	2.0	ASTM D5470
Pot life @ 25 °C	60 mins.	-
Cure @ 25 °C	5 hrs.	-
Cure @ 100°C	10 mins.	-

Typical Applications

• Automotive electronics
• Computer and peripherals
• Between any heat-generating semiconductor and a heat sink
• Telecommunications
• Thermally conductive vibration dampening

Available Forms

• Supplied in cartridge or barrel