Products
Brady PCM PC03-MT-100 consists of a thermally conductive, 60 °C phase change compound coated on a thermally conductive polyimide film. The polyimide reinforcement makes the material easy to handle and the 60 °C phase change temperature minimizes potential problems during shipping and handling.
SD-GP15 is a silicone pad which maintains optimal thermal performance. It is characterized for the easy handling and high compression properties.
SD-GP20 is a thermally conductive, reinforced material rated at a thermal conductivity of about 2.0 W/m·K, low thermal resistances can be achieved at low pressures.
SD-GP30 is recommended for low-stress applications that require a mid to high thermally conductive interface material.
SD-GP40 is a thermally conductive, reinforced material rated at a thermal conductivity of about 4 W/m·K, low thermal resistances can be achieved at low pressures.
SD-GP50 is a thermally conductive, reinforced material rated at a thermal conductivity of about 5 W/m·K, low thermal resistances can be achieved at low pressures.
SD-GP80 is a thermally conductive, reinforced material rated at a thermal conductivity of 8 W/m·K, low thermal resistances can be achieved at low pressures.
SD-GP20SF is a high-performance, compliant silicone free thermal interface material. By coupling extremely high thermal conductivity (2.0W/m·K) with exceptional ultra-soft characteristics, it provides low thermal resistance between heat source component and heat dissipation part or housing.
SD-GP30SF is a high-performance, compliant silicone free thermal interface material. By coupling extremely high thermal conductivity (3.0W/m·K) with exceptional ultra-soft characteristics, it provides low thermal resistance between heat source component and heat dissipation part or housing.
SD-GP40SF is a high-performance, compliant silicone free thermal interface material. By coupling extremely high thermal conductivity (4.0W/m·K) with exceptional ultra-soft characteristics, it provides low thermal resistance between heat source component and heat dissipation part or housing.
SD-GF2.0 is a high performance, thermally conductive, liquid gap-filling material supplied as a two-component, room or elevated temperature curing system.
SD-GF35 is a two-component thermal interface material, cured at room or elevated temperature, featuring ultra-high thermal performance and superior softness.
Ultra-conforming, designed for fragile and low-stress applications
SD-GF20SF is a non-silicone, 2-part room temperature curable gap filler suitable for using in high throughput assembly applications.
SD-GF30SF is a non-silicone, 2-part room temperature curable gap filler suitable for using in high throughput assembly applications.
SD-IP13 thermally conductive insulation material is designed for a wide variety of applications requiring high thermal performance and electrical isolation.
SD-IP15 thermally conductive insulation material is designed for a wide variety of applications requiring high thermal performance and electrical isolation.
SD-IP18 thermally conductive insulation material is designed for a wide variety of applications requiring high thermal performance and electrical isolation.
SD-PG10 is a 2 part addition cure silicone. For easy application the product was designed with very low viscosity.
SD-PG15 is a 2 part addition cure silicone. For easy application the product was designed with very low viscosity.
SD-PG20 is a 2 part addition cure silicone. For easy application the product was designed with very low viscosity.
SD-PU020 is a two-part urethane-based adhesive with thermal conductive performance
SD-PU025 is a two-part urethane-based adhesive with thermal conductive performance
SD-PU028 is a two-part urethane-based adhesive with thermal conductive performance
SD-PU117F is a two-part urethane-based adhesive. The material with low odor, low VOC, is suitable for bonding of various materials
SD-PU120 is a two-part urethane-based adhesive with thermal conductive performance. The material with low odor, low VOC, is suitable for bonding of various materials
SD-TA10 is a two-part urethanes adhesive with high thermal conductive performance.
SD-TA15GB is a one-part silicon-based adhesive with high thermal conductive performance, filled with glass bead in order to get a minimum ‘gap’ between two surfaces
SD-TA20 is a one-part silicon-based adhesive with high thermal conductive performance.
SD-90484 is a one component, high-temperature vulcanized silicon sealant. It is an addition- type organosilicon sealant without solvent volatilizes
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