SD-GFA30

Features and Benefits

• Thermal conductivity: 3.0 W/m·K
• Ultra-conforming, designed for fragile and low-stress applications
• Ambient and accelerated cure schedules
• Excellent low and high temperature mechanical and chemical stability

Typical Properties

PHYSICAL	TYPICAL RESULTS	TEST METHOD
Color	Pink	Visual
Viscosity @90psi, 1’’ orifice	19 g/min	-
Density	3.2 g/cc	ASTM D792
Hardness (Shore 00)	4	ASTM D2240
Min Filling Gap	0.1mm	-
Shelf Life @ 25°C	24 month	ASTM D412
Working Temperature Range	-50-200°C	-
Dielectric Strength	200VAC/mil	ASTM D149
Volume Resistivity (Ω·cm)	10¹²	ASTM D257
Thermal Conductivity (W/m·K)	3.0	ASTM D5470
Thermal Resistance@50psi	0.06°C-in²/W	ASTM D5470

Typical Applications

• Computer and peripherals
• Between any heat-generating semiconductor and a heat sink
• Telecommunications
• Thermally conductive vibration dampening

Available Forms

• Supplied in cartridge