SD-GP30SF

SD-GP30SF is a high-performance, compliant silicone free thermal interface material. By coupling extremely high thermal conductivity (3.0W/m·K) with exceptional ultra-soft characteristics, it provides low thermal resistance between heat source component and heat dissipation part or housing. This makes it well-suited for applications where silicone-based pads are traditionally used as well as those

applications which are silicone sensitive, especially in the optical industry.

Features and Benefits

• Thermal conductivity: 3.0 W/m·K
• Soft and slightly surface tacky
• Silicone free
• Naturally tacky for easy assembly
• UL 94 V0

Typical Properties

PHYSICAL	TYPICAL RESULTS	TEST METHOD
Color	Gray	Visual
Reinforcement Carrier	None	-
Thickness Range	1 to 3 mm	ASTM D374
Density	3.2 g/cc	ASTM D792
Tensile strength	0.02Mpa	ASTM D412
Hardness (Shore 00)	60	ASTM D2240
Dielectric Breakdown Voltage @1mm	> 7KV	ASTM D149
Volume Resistivity (Ω·cm)	10¹¹	ASTM D257
Flame Rating	V-0	UL 94
Thermal Conductivity (W/m·K)	3.0	ASTM D5470
Thermal Impedance @1mm, 20psi	0.40 °C·in.²/W	ASTM D5470
Continuous Use Temp.	-40°C to 120°C	-

Typical Applications

• Automotive Electronic Control Units (ECU's)
• Microprocessors / Graphics Processors
• Consumer electronics
• Power Supplies & Semiconductors

Available Forms

• Sheet form , max width 450mm
• die-cut parts available, can be customized