SD-GP50

SD-GP50 is a thermally conductive, reinforced material rated at a thermal conductivity of about 5 W/m·K, low thermal resistances can be achieved at low pressures. This soft interface pad conforms well to minimal pressure, resulting in excellent interfacing and wet-out characteristics, even to surfaces with high roughness and/or topography. SD-GP50 is naturally tacky, and no adhesive coating is required, to provide easy handling and converting process.

Features and Benefits

• Thermal conductivity: 5.0 W/m·K
• Soft and highly compliant
• Low thermal resistance at low pressure
• Excellent adhesive properties

Typical Properties

PHYSICAL	TYPICAL RESULTS	TEST METHOD
Color	Purple	Visual
Thickness Range	0.5 to 6 mm	ASTM D374
Density	3.2 g/cc	ASTM D792
Hardness (Shore 00)	50	ASTM D2240
Dielectric Breakdown Voltage @1mm	> 6KV	ASTM D149
Volume Resistivity (Ω·cm)	10¹¹	ASTM D257
Flame Rating	V-0	UL 94
Thermal Conductivity (W/m·K)	5.0	ASTM D5470
Thermal Impedance @1mm,20psi	0.32 °C·in.²/W	ASTM D5470
Continuous Use Temp.	-50°C to 180°C	-

Typical Applications

• Semiconductors to heat sink
• Telecommunications equipment
• Consumer electronics
• LCD and PDP flat panel TV

Available Forms

• Sheet form , max width 300mm
• die-cut parts available, can be customized