SD-TA10

SD-TA10 is a two-part urethanes adhesive with high thermal conductive performance.

The thermal conductivity of SD-TA10 is 1.0W/m-K. It can adhere well on the rough surfaces of electronic component with a better strength and proper toughness.

Features and Benefits

• Thermal conductivity: 1.0 W/m·K
• Solvent free
• High thermal conductivity
• Good adhesion to substrates

Typical Properties

PHYSICAL	TYPICAL RESULTS	TEST METHOD
Color A/B	Black/White	Visual
Viscosity- Part A	45000	GB/T 2094-2013
Density- Part A	1.7	GB/T 13477.2-2002
Viscosity- Part B	160000	GB/T 2094-2013
Density- Part B	2.2	GB/T 13477.2-2002
Mix Rate (Volume)	1:1	-
Shelf Life @ 8-28°C	6 month	-
Hardness (Shore D)	80	-
Unprimed Adhesion-Lap Shear (Al-Al)	8 MPa	GB/T 7124-2008
Temperature Usage	-45-85 °C	-
Thermal Conductivity	1.0	GB/T 10297-2015
Pot Life @ 25°C	40min
Cure @ 25 °C	7 days	-
Cure @ 80 °C	4 hours	-

Typical Applications

• Bonding integrated circuit substrates
• Adhering lids and housings
• Base plate attach
• Heat sink attach, automated or manual dispensing
• Thermally conductive structural bonding

Available Forms

• Supplied in 30cc/300cc Syringe