SD-TA20

SD-TA20 is a one-part silicon-based adhesive with high thermal conductive performance.

The thermal conductivity of SD-TA20 is 2.0W/m-K. It can adhere well on the rough surfaces of electronic component with a better strength and proper toughness.

Features and Benefits

• Thermal conductivity: 2.0 W/m·K
• Solvent free
• High thermal conductivity
• Single component
• Good adhesion to substrates

Typical Properties

PHYSICAL	TYPICAL RESULTS	TEST METHOD
Color	Grey	Visual
Viscosity	130,000 cps	ASTM D2196
Density	2.9 g/cc	Helium Pycnometer
BLT	<0.2mm	-
Shelf Life @ 0±5°C	6 months	-
Hardness	Shore A 92	ASTM D2240
Unprimed Adhesion-Lap Shear (Al)	5 MPa	ASTM D412
Elongation	20%	ASTM D412
Temperature Usage	-50°C to 200°C	-
Dielectric Strength	200 VAC/mil	ASTM D149
Volume Resistivity	10¹³Ω·cm	ASTM D257
Thermal Conductivity	2.0W/m·K	ASTM D5470
Cure @ 125 °C	45 mins	-
Cure @ 150 °C	30 mins	-

Typical Applications

• Bonding integrated circuit substrates
• Adhering lids and housings
• Base plate attach
• Heat sink attach, automated or manual dispensing
• Thermally conductive structural bonding

Available Forms

• Supplied in 30cc/300cc Syringe

Notices

SD-TA20 can not contact with N, P, S and other organic compounds, no contact with Sn, Pb, Hg, Bi. As plasma compounds, non contact with acetylene, vinyl active compounds, inability to contact peroxide, inability to contact water gas and alcohols. When these

substances reach a certain concentration, it will impede the curing of the material, which is manifested in three kinds of phenomena: it has always been in the flow state completely without curing, and the surface of the substrate is in the state of liquid or wire drawing, and the surface of the base material has tiny bubbles. Sufficient experiments should be done before use.

Heating and curing should use a hot air oven. There may be hydrogen produced during heating, keeping ventilation of heating equipment and avoiding accumulation.