SD-IP18

SD-IP18 thermally conductive insulation material is designed for a wide variety of applications requiring high thermal performance and electrical isolation. These applications typically have low mounting pressures for component clamping.

SD-IP18 material combines a smooth and highly compliant surface characteristic with high thermal conductivity. These features optimize the thermal resistance properties at low pressures.

Features and Benefits

• Thermal Conductivity: 1.8W/m K
• Electrically isolating
• Low mounting pressures
• Smooth and highly compliant surface
• General-purpose thermal interface material solution

Typical Properties

PHYSICAL	TYPICAL RESULTS	TEST METHOD
Color	Black	Visual
Reinforcement Carrier	Fiberglass	-
Thickness Range	0.23	ASTM D374
Hardness (Shore A)	88	ASTM D2240
Elongation	3%	ASTM D412
Tensile Strength	28 MPa	ASTM D412
Dielectric Breakdown Voltage	> 6kV	ASTM D149
Volume Resistivity (Ω·cm)	10¹⁰	ASTM D257
Flame Rating	V-0	UL 94
Thermal Conductivity (W/m·K)	1.8	ASTM D5470
Thermal Impedance,50 psi	0.60°C·in.²/W	ASTM D5470
Continuous Use Temp.	-40°C to 160°C	-

Typical Applications

• Power supplies
• Automotive electronics
• Motor controls
• Power semiconductor

Available Forms

• Sheet form, die-cut parts and roll form
• With or without pressure sensitive adhesive