SD-PG10

SD-PG10 is a 2 part addition cure silicone. For easy application the product was designed with very low viscosity.

It cure at room temperature but it is possible to accelerate the speed by heat.

Thanks to its long term thermal resistance (-50°C up to 180 °C ) SD-PG1.0 is successfully used as potting glue for protection and encapsulation of electrical sensitive devices and connections, LED`s lighting housings, power modules, high voltage electrical components as well as high load resistors, etc.

SD-PG1.0 is flame retardant.

Features and Benefits

• Thermal conductivity: 1.0 W/m·K
• Two-component, room or elevated temperature curing system silicone
• Low viscosity and high flow
• Excellent low and high temperature mechanical and chemical stability

Typical Properties

PHYSICAL	TYPICAL RESULTS	TEST METHOD
Color / Part A	White	Visual
Color / Part B	Black	Visual
Viscosity / Part A	3,000 mPas	Brookfield 4# 20rpm
Viscosity / Part B	3,000 mPas	Brookfield 4# 20rpm
Viscosity as Mixed	3,000 mPas	Brookfield 4# 20rpm
Density	1.85 g/cc	ASTM D1875-2003
Mix Ratio	1:1	-
Shelf Life @ 25°C	12 months	-
PROPERTY AS CURED
Color	Black	Visual
Hardness, Shore A	45	ASTM D2240
ELECTRICAL AS CURED
Dielectric Strength	18kV/mm	ASTM D149
Volume Resistivity (Ω·cm)	≥ 1x10¹⁰	ASTM D257
Flame Rating	V-0	UL 94
THERMAL AS CURED
Thermal Conductivity (W/m·K)	1.0	ASTM D5470
Pot life @ 25 °C	60 mins.	-
Cure @ 25 °C	24 hrs.	-
Cure @ 100°C	30-60 mins.	-
Working Temp.	-50-180°C	-

Typical Applications

• Automotive electronics
• Power supplies
• Connectors
• Sensors
• Industrial controls
• Transformers
• High voltage resistor packs

Available Forms

• Supplied in 20KG barrel