SD-PG15

SD-PG15 is a 2 part addition cure silicone. For easy application the product was designed with very low viscosity.

It cure at room temperature but it is possible to accelerate the speed by heat.

Thanks to its long term thermal resistance (-50°C up to 180 °C ) SD-PG15 is successfully used as potting glue for protection and encapsulation of electrical sensitive devices and connections, LED`s lighting housings, power modules, high voltage electrical components as well as high load resistors, etc.

SD-PG15 is flame retardant.

Features and Benefits

• Thermal conductivity: 1.5 W/m·K
• Two-component, room or elevated temperature curing system silicone
• Low viscosity and high flow
• Excellent low and high temperature mechanical and chemical stability

Typical Properties

PHYSICAL	TYPICAL RESULTS	TEST METHOD
Color / Part A	White	Visual
Color / Part B	Black	Visual
Viscosity / Part A	6,000 mPas	Brookfield 4# 20rpm
Viscosity / Part B	6,000 mPas	Brookfield 4# 20rpm
Viscosity as Mixed	6,000 mPas	Brookfield 4# 20rpm
Density	2.3 g/cc	ASTM D1875-2003
Mix Ratio	1:1	-
Shelf Life @ 25°C	12 months	-
PROPERTY AS CURED
Color	Gray	Visual
Hardness, Shore A	40	ASTM D2240
ELECTRICAL AS CURED
Dielectric Strength	20 kV/mm	ASTM D149
Volume Resistivity (Ω·cm)	≥ 1x10¹³	ASTM D257
Flame Rating	V-0	UL 94
THERMAL AS CURED
Thermal Conductivity (W/m·K)	1.5	ASTM D5470
Pot life @ 25 °C	60 mins.	-
Cure @ 25 °C	12 hrs.	-
Cure @ 80°C	60 mins.	-
Working Temp.	-50-180°C	-

Typical Applications

• Automotive electronics
• Power supplies
• Connectors
• Sensors
• Industrial controls
• Transformers
• High voltage resistor packs

Available Forms

• Supplied in 20KG barrel

使用说明

烘箱条件:N2 烘箱(建议)或空气烘箱。

一些物质的存在可能会抑制或影响固化：有机锡类和其他金属化合物；含有机锡类催化剂的硅橡胶、硫、聚硫化合物、聚砜类物或其它含硫类物质；胺、聚氨酯橡胶或者其他含氨的物质；含磷的物质;不饱和烃增塑剂；助焊剂残留物等。

将被粘贴物表面的油分、水分、尘土等杂质清除干净； A，B 组分按照重量比为 1:1 准确称量。 混合:将 A,B 组分混合均匀，必要时需采用真空脱泡。(A、B 组分底部可能会有部分沉降，混合前注意搅匀) 浇注:混合好的应在操作时间内用完，否则粘度升高，无法浇注。